SY10xx Daisy Chain
Daisy-chain dummy IC for soldering process optimization
The SY10xx daisy-chain CBGA package is derived from the SY1007 substrate and is manufactured using the same materials (substrate, lid, balls) and processes. It therefore closely corresponds to the SY10xx’s package and can be used to validate the soldering process for the SY10xx chip-set with confidence.
The pin assignment is shown in Figure 1 of the datasheet (downloadable; see below). Due to the use of the substrate of the SY1007, all pins corresponding to AVSS are shorted together.
The mechanical dimensions of this daisy-chain package correspond exactly to the ones of the SY10xx chip-set packages.
Features
- Based on the SY1007 ceramic substrate.
- Manufactured using the same materials (substrate, lid, balls) and processes as SY10xx devices.
- Reliable tool to develop and validate the soldering process for the SY10xx devices.
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